IC Design Researcher

Ericsson AB Join our Team About the Opportunity As a Researcher in IC Design and Multichip Integration, you will work with a motivated group of experts driving advancements in the System-on-Package domain. This unique position offers you the opportunity to work on diverse and exciting tasks—ranging from exploring emerging technologies to supporting Proof of Concepts (PoCs) for applications spanning from portable devices to high-power base stations. Your contributions will bridge the gap between System-on-Chip (SoC) and System-on-Package (SoP), helping to build Ericsson's future patent portfolio and shaping our research strategies. If you're a creative researcher passionate about innovation, this role is for you! What You Will Do • Conducting research studies across multiple technology nodes, measurements, or computer simulations and effectively documenting and communicating results. • Creating new circuit solutions and protecting them through Intellectual Property Rights (IPR). • Representing Ericsson in university collaborations, as well as in customer and supplier meetings. • Influencing Ericsson's research strategies to help shape the future of our technologies. • Developing evaluation tools, demonstrators, or Proof of Concepts to validate new ideas. • Exploring the potential of heterogeneous integration and advanced packaging for enhanced system performance. • Identifying new opportunities at the system level enabled by cutting-edge integration techniques. The Skills You Bring Minimum Qualifications: • PhD in Electrical Engineering, Microelectronics, or a related field, or equivalent research experience with a strong publication record. • Solid fundamentals of electronic circuit design theory for wireless transceivers at RF. • Hands-on expertise in the design at transistor level, layout, and measurement of analog, mixed-signal, or RF IC design, with a strong curiosity for cross-domain applications. • Proficiency with design tools and simulators such as Cadence Spectre, Virtuoso, Calibre, Momentum. • Solid analytical and problem-solving skills with the ability to address complex technical challenges. Preferred Skills and Experience: • 5+ years of experience in IC design in CMOS technology with experience in leading research topics and multiple tape outs. • Understanding of integration aspects, including chip integration, package/PCB technology, and package design and simulations. • Knowledge of RF IC transceiver architectures, system design, and tradeoffs for both device and base station applications. • Experience with tools like Ansys HFSS, Allegro, or equivalent for package and PCB design. • Familiar with system-level simulations using tools like Matlab or Simulink.